Development of a Flat-Plate Cooling Device for Electronic Packaging

ETRI Journal

关键词: condensed droplet;    phase change;    thermal resistance;    thermal packaging;    Electronic cooling;   

Others  :  1186092
DOI  :  10.4218/etrij.11.0210.0322

【 摘 要 】

In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved.

   

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