期刊论文详细信息
ETRI Journal | |
Novel Maskless Bumping for 3D Integration | |
关键词: low-melting-point solder; solder bump maker (SBM); Maskless bumping; | |
Others : 1185977 DOI : 10.4218/etrij.10.0209.0396 |
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【 摘 要 】
A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 μm and 150 µm.
【 授权许可】
【 预 览 】
Files | Size | Format | View |
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20150520120334144.pdf | 543KB | download |
【 参考文献 】
- [1]B. Dang et al., "3D Chip Stacking with C4 Technology," IBM J. Res. & Dev., vol. 52, no. 6, Nov. 2008, pp. 599-609.
- [2]K. Sakuma et al., "3D Chip-Stacking Technology with Through-Silicon Vias and Low-Volume Lead-Free Interconnections," IBM J. Res. & Dev., vol. 52, no. 6, Nov. 2008, pp. 611-622.
- [3]Y.S. Eom et al., "Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film," Microelectron. Eng., vol. 85, 2008, pp. 327-331.
- [4]Y.S. Eom et al., "Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder," Microelectron. Eng., vol. 85, 2008, pp. 2202-2206.
- [5]Y.S. Eom et al., "Electrical Interconnectioin with a Smart ACA Composed of Fluxing Polymer and Solder Powder," ETRI J., to be published.