Novel Maskless Bumping for 3D Integration

ETRI Journal

关键词: low-melting-point solder;    solder bump maker (SBM);    Maskless bumping;   

Others  :  1185977
DOI  :  10.4218/etrij.10.0209.0396

【 摘 要 】

A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 μm and 150 µm.

   

【 参考文献 】

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