Effect of Sn Addition on Transformation Temperature and Thermal Properties for Cu-Al-Si Shape Memory Alloy

International Conference on Materials Engineering and Science

Ahmed Adnan, Raad S.^1 ; Abudlbaki, Mina M.^1

Department of Materials Engineering University of Technology, Baghdad, Iraq^1

关键词: Base alloys;    Computer modeling;    DSC measurements;    Equilibrium temperatures;    Graphical integration;    SEM-EDS;    Transformation temperatures;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/454/1/012050/pdf
DOI  :  10.1088/1757-899X/454/1/012050

来源: IOP

【 摘 要 】

Sn was added to Cu-14%Al-4.5%Ni shape memory alloy in three Percentages (0.5,1,3)%to study the effect of the addition on microstructure, Transformation temperature, thermal properties and activation energythermal properties. SEM-EDS, XRD tests were performed on the specimens; DSC Measurement was performed on the alloys. A computer model was built via MATLAB to calculate the thermal properties by means of graphical integration for the DSC data. Results showed an increase in the transformation temperature and Equilibrium temperature outside the domain, also an increase in hysterics and spread with the increase of Sn Percentage, also results shown an increase in thermal properties (enthalpy and entropy and free energy), results showed also a decrease in activation energy more than the base alloy the 3% Sn Addition gave the best results in both transformation temperature and activation energy.