Examine temperature field at sealing surfaces treated by laser sealing using Ansys software

2018 3rd International Conference on Insulating Materials, Material Application and Electrical Engineering

材料科学;无线电电子学;电工学

Nguyen, Trong Tuan^1,2 ; Nguyen, Tat Thang^3,4 ; Le, Ngoc Hoan^2,5 ; To, Quoc Huy^2 ; Hua, Jun^1

Department of Mechanical Design and Theory, College of Mechanical Engineering, Northeast Forestry University, Harbin

150040, China^1

Vietnam Academy of Forest Sciences, Ha Noi, Viet Nam^2

Key Laboratory of Bio-based Material Science and Technology, Ministry of Education, Northeast Forestry University, Harbin

150040, China^3

Vietnam National University of Forestry, Ha Noi, Viet Nam^4

Forest Industries Research Centre, University of the Sunshine Coast, Australia^5

关键词: Adhesive layers;    Binding efficacy;    Field investigation;    Induced temperature;    Irradiated area;    Melting adhesives;    Optimal temperature;    Three dimensional finite element simulation;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/452/2/022010/pdf
DOI  :  10.1088/1757-899X/452/2/022010

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Upon deposition of laser irradiation on sealing surface, energy build-up heats up the structural radiation area, significantly and rapidly changing the mechanical properties of the materials in the irradiated area. Consequently, the change of material properties leads to the liquidation of the radiated surfaces which is responsible for the binding efficacy of EVA glue. It is therefore important to investigate the temperature field during the transient sealing period. In our study we demonstrate a method of temperature field investigation by finite element analysis using Ansys software. Three-dimensional finite element simulation is employed to investigate the temperature fields and heat flux in a 0.2mm-thick adhesive layer on surface of a sealing edge with total thickness of 0.5mm x 22mm width. The laser beam was emitted by a device with laser power of 3kw, scanning speed 100mm/s, 980nm wavelength, induced temperature ranging from 100°C to 160°C. Results proved optimal temperature of 135°C, inducing total heat flux of 8731.8 w/m2 which is suitable for melting adhesive for optimized binding efficacy. Our study introduced the optimal temperature, heat flux generated by the laser beam yet retaining performance of adhesive, as well as ascertaining binding efficacy and durable linkage between EVA glue and surface of wooden boards.