Thermal-Structural Coupling Analysis of PCBA System

2018 3rd International Conference on Insulating Materials, Material Application and Electrical Engineering

材料科学;无线电电子学;电工学

Su, Wei^1,3 ; Zhu, Junhua^1,2 ; Liu, Renhuai^1,2,3 ; He, Zhiyuan^1

Scienceand Technol. on Reliability Phys. and Applic. Technology of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China^1

Department of Mechanics and Civil Engineering, Jinan University, Guangzhou, China^2

MOE Key Lab of Disaster Forecast and Control in Engineering, Jinan University, Guangzhou, China^3

关键词: ANSYS package;    Deformation analysis;    Simple modeling;    System components;    Thermal and structural analysis;    Thermal-structural coupling;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/452/2/022015/pdf
DOI  :  10.1088/1757-899X/452/2/022015

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

In this paper, the thermal and structural analysis of the PCBA system is provided by using the 3-D ANSYS package. The results of thermal and structural analysis for complex and simple model are compared. The paper also describes the deformation analysis of the PCBA system components, and the weak components sensitive to thermal stress are determined though thermal-structual analysis. The results of thermal analysis are helpful to the optimizing overall arrangement design of PCBA system.