Development of a Support Bump for Increasing the Energy Absorption of a Jounce Bump

5th International Conference on Mechanics and Mechatronics Research

机械制造;无线电电子学

Lee, C.H.^1 ; Han, M.J.^1 ; Park, T.W.^1 ; Lee, S.J.^2 ; Park, J.S.^2

Department of Mechanical Engineering, Ajou University, Gyeonggi, 16499, Korea, Republic of^1

DONGYANG PandC, 149 Wondang-ro, Chilgok-ri, Wongok-myeon, Anseong-si, Gyeonggi

1755, Korea, Republic of^2

关键词: Durability test;    Load deflection;    Simulation model;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/417/1/012004/pdf
DOI  :  10.1088/1757-899X/417/1/012004

来源: IOP

【 摘 要 】

In this study, we developed a support bump to increase the energy absorption of the jounce bump. The support bump is made of TPE material, and the jounce bump is made of TPU material. The support and jounce bump each verified the simulation model using the load deflection test. The developed support and jounce bump were satisfied with the durability test. The support bump was assembled with the jounce bump and confirmed that the energy absorption amount was increased compared with the single jounce bump. Finally, we verified the validity of the simulation by comparing the load deflection data under the same conditions as the test using the verified the support and jounce bump simulation model.