Analytical investigation of copper substrate fins of various profiles for heat transfer applications

2nd International conference on Advances in Mechanical Engineering

Anandhavaradhan, S.^1 ; Iyer, Yashkumar^1 ; Ahmed, Aashiq^1 ; Prabhu, S.^1

Department of Mechanical Engineering, SRM Institute of Science and Technology, Chennai, India^1

关键词: Analytical investigations;    Effectiveness;    Finite element analysis software;    Fins;    Heat dissipation properties;    Heat transfer applications;    Rate of heat transfer;    Temperature drops;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/402/1/012011/pdf
DOI  :  10.1088/1757-899X/402/1/012011

来源: IOP

【 摘 要 】

Fins are surfaces that extend from an object to increase rate of heat transfer by increasing surface area. Traditionally, fin profiles have been rectangular in shape. However, in recent years a trend has emerged where fin profiles have been designed in a variety of shapes in order to maximize heat dissipation properties. Here different fin profiles (both symmetrical and non-symmetrical) will be designed using modelling software and the temperature drop across the fin surface will be monitored in order to study the heat dissipation effectiveness of each fin profile. The analysis is done using Finite Element Analysis Software.