LabVIEW Simulation for Electroplating Process of Plated-Through Hole (PTH) in Multilayer Printed Circuit Board (PCB)

7th Nanoscience and Nanotechnology Symposium

物理学;材料科学

Arifin, M.^1,2 ; Atmaja, A.B.K.^1 ; Octowinandi, V.^1,2

Department of Electrical Engineering, Politeknik Negeri Batam, Batam

29461, Indonesia^1

Teaching Factory Manufacturing of Electronics, Politeknik Negeri Batam, Batam

29461, Indonesia^2

关键词: Calculation results;    Electroplating process;    Faraday's laws;    Lab-view softwares;    Multi-layer pcbs;    Multilayer printed circuit board;    Plated through hole;    Research objectives;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/395/1/012016/pdf
DOI  :  10.1088/1757-899X/395/1/012016

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Plated-through hole (PTH) is essential part which it connects one layer to other layers in multilayer printed circuit board (PCB). PTH is commonly made by electroplating process with copper as based conductive material. This research objective to simulate the electroplating process in which mass of copper generated using LabVIEW which it is used together with Faraday's law of electrolysis. The simulation using LabVIEW software and experiment are applied in this study. The simulation and the calculation results of copper mass on the PCB and PTH surfaces were displayed in LabVIEW interface. On the other hand, the experiment is also conducted to form PTH and determine the mass of copper experimentally on the PCB and PTH surfaces. The experiment results showed that PTH was successfully formed in multilayer PCB with electroplating process. The results of copper mass adhered in multilayer PCB in which they were obtained from LabVIEW simulation or calculation are not much different with the copper masses obtained experimentally. The copper masses obtained from experiment tend smaller than the calculation.