A Co-Simulation Analysis Method for Improving PCB EMC Performance

2018 5th International Conference on Advanced Composite Materials and Manufacturing Engineering

Huang, Luchen^1 ; Huang, Hui^1 ; Dong, Yaru^1

School of Electrical Engineering, Beijing Jiaotong University, Beijing

100044, China^1

关键词: Co-simulations;    Design costs;    Development cycle;    EMC performance;    Near fields;    Switching power supplies;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/394/4/042114/pdf
DOI  :  10.1088/1757-899X/394/4/042114

来源: IOP

【 摘 要 】

Based on the principle of the combination of field and circuit, the co-simulation method of the PCB EMC for switching power supply is carried out in this paper. We used the frequency variable source as the simulation excitation, which is closer to the actual work situation of PCB than the traditional sweep source. According to the distribution of the E and H near field, the EMC performance of PCB can be predicted, and we improved the structure of PCB by reducing the number of vias and increasing the trace width. The EMC performance of the switching power supply PCB is improved, and this method also has the advantages of reducing design costs and shortening the development cycle.