Automated line integration from through hole technology to integrated circuit testing

3rd International Conference on Materials and Manufacturing Engineering 2018

Joseph, Roshan Abraham^1 ; Sakthivel, G.^1

School of Mechanical and Building Sciences, Vellore Institute of Technology, Chennai, India^1

关键词: Automated lines;    Automated materials;    Automated systems;    Maximum production rate;    Printed circuit boards (PCB);    Production rates;    Production simulation;    Through hole;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/390/1/012104/pdf
DOI  :  10.1088/1757-899X/390/1/012104

来源: IOP

【 摘 要 】

Through Hole Technology (THT) is a method in electronic printed circuit board (PCB) mounting technology by which components are mounted on the PCB board and it is later sent for Integrated circuit testing (ICT). The in-process material movement is the real culprit for decreased production rates. Here we discuss the various identified reasons for the same and calculated effective possible maximum production rates and improvise the process with the help of an automated material transfer system and validate the same using production simulation software called Tecnomatix. Each of the system i.e. the manual and the automated system was studied, and appropriate corrective decision was taken to improvise the overall productivity.