Performance analysis of an array of square micro-fins

International Conference on Mechanical, Materials and Renewable Energy

机械制造;材料科学;能源学

Debnath, Tapas^1 ; Mehta, Sumit Kumar^1 ; Patowari, Promod Kumar^1

Department of Mechanical Engineering, NIT Silchar, Assam

788010, India^1

关键词: Heat transfer performance;    Micro fins;    Micro pin fin heat sinks;    Numerical investigations;    Parametric conditions;    Performance analysis;    Thermal Performance;    Workpiece materials;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/377/1/012056/pdf
DOI  :  10.1088/1757-899X/377/1/012056

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Array of micro pin fin heat sinks shows higher thermal efficiency in high heat flux and critical devices such as aerospace, microelectronic etc. In this work, an array of micro square pin fins has been designed and for this copper is selected as workpiece material. Moreover, a numerical investigation of thermal performances and mechanical behavior of the designed fins has been carried out. The effects of Reynolds numbers on velocity profile and heat transfer performance have also been studied. Additionally, the equivalent (von-Mises) stress along with the structural and total deformations have been observed at the desired pressure applied on the surface of the pin fins. Numerical simulations with similar parametric conditions have also been conducted on a plate having the same dimensions without fins, and a comparison has been made with a plate having micro-fins. It has been observed that the array of square micro pin fins gives a better thermal performance than that of without fins.