Heat Transfer Numerical Simulation and Optimization of a Heat Sinks

International Conference on Advances in Manufacturing, Materials and Energy Engineering 2018

材料科学;能源学

Sharath, D.^1 ; Sathyanarayana^1 ; Puneeth, H.S.^2

Department of Mechatronics Engineering, Mangalore Institute of Technology and Engineering, Moodabidri, Karnataka, India^1

Department of Aeronautical Engineering, Mangalore Institute of Technology and Engineering, Moodabidri, Karnataka, India^2

关键词: Air velocities;    Dissipation methods;    Electronic component;    Operating condition;    Operating temperature;    Pin-fins;    Simulation and optimization;    Staggered arrays;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/376/1/012005/pdf
DOI  :  10.1088/1757-899X/376/1/012005

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

In order to maintain operating temperature of the integrated circuits in electronic components there is a continuous need for effective cooling by proper heat dissipation method there by keeping operating conditions within safe level. To achieve this continuous research has been carried out for various heat sinks with different orientations and geometries. In the present work heat transfer coefficient of fin with different orientation and geometries is compared for increasing the heat transfer by reducing the pressure gradient, thermal resistance and laminar air velocities. these consists of pin fins that can be of different cross sections like circular, elliptical and square of inline and staggered array type.