Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

International Conference on Aerospace and Mechanical Engineering 2017

航空航天工程;机械制造

Mukhtar, M.A.Fatah M.^1 ; Abas, Aizat^2 ; Haslinda, M.S.^2 ; Ani, F. Che^3,4 ; Abdullah, M.Z.^5 ; Jalar, A.^3 ; Ismail, R.^3

Faculty of Engineering, DRB-Hicom University of Automotive Malaysia, Pekan, Pahang

26607, Malaysia^1

School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Penang, Nibong Tebal

14300, Malaysia^2

Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi, Selangor

43600, Malaysia^3

Jabil Circuits, 56, Hilir Sungai Kluang 1, Bayan Lepas, Penang

11900, Malaysia^4

School of Aerospace Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal, Penang

14300, Malaysia^5

关键词: Current modeling;    Discrete phase model;    Dispersion of nano particles;    Micro-void formation;    Passive surfaces;    TiO2 nano-particles;    Volume of fluids;    Weight percentages;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/370/1/012067/pdf
DOI  :  10.1088/1757-899X/370/1/012067

学科分类：航空航天科学

来源: IOP

【 摘 要 】

This paper presents a preliminary study of the interaction between two models of numerical simulation namely volume of fluid (VOF) and discrete phase model (DPM). The multiphase-DPM model is capable of tracking the trajectory of the TiO2 nanoparticles that has been doped in the lead free solder Sn-3.0Ag-0.5Cu (SAC305). The current model was developed based on passive surface mount component 01005 capacitor that undergoes conventional reflow process. The trajectory of the nanoparticles at 0.01, 0.05 and 0.15wt% in the molten solder is shown in the flow front of the wetted molten solder. At 0.05wt% of nanoparticles, good dispersion of nanoparticles, pressure distribution and wetting time was found. The difference in wetting time are about 3.76% and 0.46% for 0.05wt% and 0.15wt% compared to 0.01wt% nanoparticle. The trajectory of the nanoparticles are shown to move along with the wetting formation of the molten solder. The pressure distribution and velocity vector of the different weight percentage of nanoparticles are also be studied. Higher pressure distribution is found at the capacitor area and intermetallic compound (IMC) region. The higher pressure distribution projected to reduce the micro void formation and optimize the reliability of the solder joint.