Mechanical Properties of Oxide Films on Electrolytic In-process Dressing (ELID) Copper-based Grinding Wheel

International Conference on Computer Information and Automation Engineering

计算机科学;运输工程

Kuai, J.C.^1 ; Wang, J.W.^1 ; Jiang, C.R.^1 ; Zhang, H.L.^2 ; Yang, Z.B.^1

School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo, Henan

454003, China^1

School of Mechanical Engineering, Nantong University, Nantong, Jiangsu

226019, China^2

关键词: Copper-based;    Electrolytic in process dressing (ELID);    Load displacements;    Nanoindentation techniques;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/359/1/012013/pdf
DOI  :  10.1088/1757-899X/359/1/012013

学科分类：计算机科学（综合）

来源: IOP

【 摘 要 】

The mechanical properties of oxide films on copper based grinding wheel were studied by nanoindentation technique. The analysis of load displacement shows that the creep phenomenon occurs during the loading stage. Results show that the oxide film and the matrix have different characteristics, and the rigidity of the copper based grinding wheel is 0.6-1.3mN/nm, which is weaker than that of the matrix; the hardness of the oxide film is 2000-2300MPa, which is higher than the matrix; and the elastic modulus of the oxide film is 100-120GPa, also higher than the matrix.