Resin bleed improvement on surface mount semiconductor device

International Conference on Innovative Technology, Engineering and Sciences 2018

工业技术;自然科学

Rajoo, Indra Kumar^1 ; Tahir, Suraya Mohd^1 ; Aziz, Faieza Abdul^1 ; Anuar, Mohd Shamsul^2

Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia, UPM Serdang, Selangor

43400, Malaysia^1

Department of Process and Food Engineering, Faculty of Engineering, Universiti Putra Malaysia, UPM Serdang, Selangor

43400, Malaysia^2

关键词: Customer complaints;    End customers;    Epoxy compound;    Molding process;    Plating process;    Semiconductor companies;    Transparent layers;    Visual inspection;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/342/1/012024/pdf
DOI  :  10.1088/1757-899X/342/1/012024

来源: IOP

【 摘 要 】

Resin bleed is a transparent layer of epoxy compound which occurs during molding process but is difficult to be detected after the molding process. Resin bleed on the lead on the unit from the focused package, SOD123, can cause solderability failure at end customer. This failed unit from the customer will be considered as a customer complaint. Generally, the semiconductor company has to perform visual inspection after the plating process to detect resin bleed. Mold chase with excess hole, split cavity & stepped design ejector pin hole have been found to be the major root cause of resin bleed in this company. The modifications of the mold chase, changing of split cavity to solid cavity and re-design of the ejector pin proposed were derived after a detailed study & analysis conducted to arrive at these solutions. The solutions proposed have yield good results during the pilot run with zero (0) occurrence of resin bleed for 3 consecutive months.