Investigation of Annealing Temperature on Copper Oxide Thin Films Using Sol-Gel Spin Coating Technique

6th International Conference on Electronic Devices, Systems and Applications 2017

无线电电子学;工业技术

Hashim, H.^1 ; Samat, S.F.A.^1 ; Shariffudin, S.S.^1 ; Saad, P.S.M.^1

Faculty of Electrical Engineering, Universiti Teknologi Mara, Selangor, Shah Alam

40450, Malaysia^1

关键词: Annealing process;    Annealing temperatures;    Copper oxide thin films;    Effect of annealing;    Optical measurement;    Quartz substrate;    Sol-gel spin coating;    Surface profilers;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/340/1/012008/pdf
DOI  :  10.1088/1757-899X/340/1/012008

学科分类：工业工程学

来源: IOP

【 摘 要 】

Copper (II) Oxide or cupric oxide (CuO) is one of the well-known materials studied for thin films applications. This paper was studied on the effect of annealing temperature to CuO thin films using sol-gel method and spin coating technique. The solution was prepared by sol-gel method and the thin films were synthesized at various temperatures from 500°C to 700°C that deposited onto the quartz substrates. After the annealing process, the thin films were uniform and brownish black in colour. The measurements were performed by atomic force microscopy (AFM), surface profiler (SP), two-point probe and Ultraviolet-visible (UV-Vis-NIR) spectrometer. From the optical measurement, the band gap was estimated to be 1.44eV for sample annealed at 550°C.