Modification of CuI based Hole Transport Material for Solid State DSSC Application

International Conference on Advanced Materials for Better Future 2017

Hanif, Q.A.^1 ; Ramelan, A.H.^2 ; Saputri, L.N.M.Z.^1 ; Wahyuningsih, S.^1

Inorganic Material Research Group, Faculty of Mathematics and Natural Sciences, Universitas Sebelas Maret, Ir. Sutami street 36A, Surakarta, Indonesia^1

Electronic Materials and Energy, Faculty of Mathematics and Natural Sciences, Universitas Sebelas Maret, Ir. Sutami street 36A, Surakarta, Indonesia^2

关键词: Ammonium thiocyanate;    Band gap energy;    Copper iodides (CuI);    Counter electrodes;    Hole transport materials;    Tetramethylethylenediamine;    Volume variation;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/333/1/012029/pdf
DOI  :  10.1088/1757-899X/333/1/012029

来源: IOP

【 摘 要 】

Modification of Hole Transport Material (HTM) with addition of tetramethylethylenediamine (TMED) and ammonium thiocyanate (NH4SCN) have been conducted. Copper Iodide (CuI) were used as the main component of HTM. Several volume variations of TMED (0.1; 0.2; and 0.4 mL) was added into 0.05 M CuI solutions. While TMED: NH4SCN ratio were 1:1,1:2,2:1 also introduced to the dissolved CuI. Optical properties of these materials showed the band gap energy value ranging from 2.38 to 3.79 eV. The conductivity of HTM has been measured and showed the maximum value in CuI added with 0.4 mL TMED = 0.29 S m-1, and ratio of TMED: NH4SCN=2:1 added into CuI = 0.39 S m-1, these value were increased compared to the CuI conductivity itself (0.26 S m-1). The effect of this modification towards SS DSSC efficiency also has been monitored. The SS DSSC construction consists of TiO2nanorods sensitized by N3, HTM, and platinum as a counter electrode. The performance of SS DSSC showed rising efficiency as follows TiO2|N3|CuI4SCN|Pt. The highest conversion was increased 3.28 times when CuI-TMED: NH4SCN used as a HTM. Therefore, both TMED and NH4SCN incorporated with CuI be able to improve the electrical properties in SS DSSC system.