Destructive and non-destructive evaluation of cu/cu diffusion bonding with interlayer aluminum

International Conference on Recent Advances in Materials, Mechanical and Civil Engineering

材料科学;机械制造;土木建筑工程

Santosh Kumar, A.^1 ; Mohan, T.^1 ; Suresh Kumar, S.^1 ; Ravisankar, B.^1

Department of Metallurgical and Materials Engineering, National Institute of Technology, Tiruchirappalli

Tamil Nadu

620 015, India^1

关键词: Bonding characteristics;    Bonding parameters;    Element compositions;    Energy dispersive spectrometry;    Inspection procedures;    Non destructive evaluation;    Nondestructive methods;    Nondestructive testing method;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/330/1/012045/pdf
DOI  :  10.1088/1757-899X/330/1/012045

来源: IOP

【 摘 要 】

The current study is established an inspection procedure for assessing quality of diffusion bonded joints using destructive and non-destructive method. Diffusion bonding of commercially pure copper with aluminium interlayer was carried out uniaxial load at 15MPa for different temperatures under holding time 60 min in vacuum atmosphere. The bond qualities were determined by destructive and non-destructive testing method (ultrasonic C- scan). The bond interface and bonded samples were analysed using optical and scanning electron microscopy (SEM). The element composition of the fractured and bonded area is determined using the Energy Dispersive Spectrometry (EDS). The bond quality obtained by both testing methods and its parameters are correlated. The optimized bonding parameter for best bonding characteristics for copper diffusion bonding with aluminum interlayer is reported.