Ultrasonic-assisted soldering of Cu/Ti joints

2017 International Symposium on Application of Materials Science and Energy Materials

材料科学;能源学

Cui, Wei^1 ; Wang, Chunyu^1 ; Li, Yuhang^1 ; Zhong, Tongtong^1 ; Yang, Jianguo^2 ; Bao, Yefeng^1

College of Mechanical and Electrical Engineering, Hohai University, Changzhou

213022, China^1

College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou

310014, China^2

关键词: Joining method;    Low temperature soldering;    Pure copper;    Sn-Ag-Cu;    Sn-based solders;    Sonication parameters;    TC4 titanium alloy;    Ti alloys;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/322/2/022020/pdf
DOI  :  10.1088/1757-899X/322/2/022020

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Cu/Ti joints are expected to be used in various applications, while reliable joining method is still to be developed. It is commonly not possible to solder Ti alloys using Sn-based solder alloys because of their poor wettability. In this study, Sn-Ag-Cu soldering filler metal was used to joining TC4 titanium alloy and pure copper using ultrasonic-assisted soldering. The influence of different temperature and different ultrasonic time on the welded joint is studied and explored. Microstructure of the joints was investigated. Shear strength of the joints reached the maximum value, i.e. 38.2MPa. Relationship between the sonication parameters and the microstructure and strength of the joints was discussed. Thus, it is verified that dissimilar metal brazing of TC4 and copper is suitable for low temperature soldering.