会议论文详细信息
4th Asia Pacific Conference on Manufacturing Systems; 3rd International Manufacturing Engineering Conference
Stress analysis on the reinforcement particles of the metal matrix composite by Raman spectroscopy
Asif Iqbal, A.K.M.^1 ; Arai, Yoshio^2
Faculty of Manufacturing Engineering, University Malaysia Pahang, Pekan, Pahang
26600, Malaysia^1
Division of Mechanical Engineering and Science, Graduate School of Science and Engineering, Saitama University, 338-8570, Japan^2
关键词: Final failures;    Interfacial debonding;    Micro Raman Spectroscopy;    Monotonic loading;    Particle fracture;    Particle/matrix interface;    Reinforcement particles;    Secondary cracks;   
Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/319/1/012065/pdf
DOI  :  10.1088/1757-899X/319/1/012065
来源: IOP
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【 摘 要 】

In this research, the stress state of the reinforcing SiC particles in a hybrid MMC is investigated by micro Raman spectroscopy. The experiment was carried out in situ in the Raman spectroscopy. Experimental results show that cracks due to monotonic loading propagates by the debonding of the particle/matrix interface and particle fracture. Moreover, secondary cracks form in front of the main crack tip coalesce with the main crack in subsequent loading and final failure occurs. A high decrease in stress (several hundred in MPa) is observed with the interfacial debonding at the interface and with the particle fracture on the particle. The critical tensile stresses for particle-matrix interface debonding and particle fracture develop in hybrid MMC are also estimated during the crack propagation.

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