The Effect of Copper Addition on the Properties of Sn-0.7Cu Solder Paste

Malaysian Technical Universities Conference on Engineering and Technology 2017

Said, R.M.^1 ; Mohamad Johari, F.H.^1 ; Mohd Salleh, M.A.A.^1 ; Sandu, A.V.^2

Centre of Excellence Geopolymer and Green Technology, School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, Jejawi, Arau Perlis

02600, Malaysia^1

Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Lasi, Romania^2

关键词: Bulk solder microstructure;    Cu concentrations;    Effect of coppers;    Hardness values;    High temperature;    Processing temperature;    Sn-0.7Cu solder;    Solder material;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/318/1/012062/pdf
DOI  :  10.1088/1757-899X/318/1/012062

来源: IOP

【 摘 要 】

The effect of copper addition on the properties of Sn-Cu based solder paste were investigate through this study. The Sn-0.7Cu solder paste doped with different concentration of Cu were prepared using solder paste mixture. The bulk solder microstructure of assolidified solder paste was studied. Besides that, intermetallic compound (IMC) formation on Cu substrate and hardness of all solder paste also being investigated. Results shows that increasing Cu concentration cause formation of large Cu6Sn5IMC at bulk solder and the size of the IMC grew larger at high temperature. In addition, β-Sn area reduce when Cu concentration was high. The IMC morphology for all solder paste almost remain unchanged. However, there are large Cu6Sn5IMC form near the interfacial IMC in Sn-Cu solder paste with high amount of Cu (Sn-10Cu). The hardness value was decrease when processing temperature at 250 °C due to present of small void in the microstructure while hardness of solder material increased at high temperature.