Ultra-low Temperature Curable Conductive Silver Adhesive with different Resin Matrix

4th International Conference on Advanced Engineering and Technology

Zhou, Xingli^1 ; Wang, Likun^1 ; Liao, Qingwei^1 ; Yan, Chao^1,2 ; Li, Xing^1 ; Qin, Lei^1

Research Center of Sensor Technology, Beijing Information Science and Technology University, Beijing

100192, China^1

Tianjin Key Laboratory of Optoelectronic Detection Technology and System, School of Electronics and Information Engineering, Tianjin Polytechnic University, Tianjin

300387, China^2

关键词: Adhesive properties;    Conductive adhesive;    Conductive properties;    Curing temperature;    Curing time;    Piezoelectric composite materials;    Resin matrix;    Ultra low temperatures;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/317/1/012016/pdf
DOI  :  10.1088/1757-899X/317/1/012016

来源: IOP

【 摘 要 】

The ultra-low temperature curable conductive silver adhesive with curing temperature less than 100 °C needed urgently for the surface conductive treatment of piezoelectric composite material due to the low thermal resistance of composite material and low adhesion strength of adhesive. An ultra-low temperature curable conductive adhesive with high adhesion strength was obtained for the applications of piezoelectric composite material. The microstructure, conductive properties and adhesive properties with different resin matrix were investigated. The conductive adhesive with AG-80 as the resin matrix has the shorter curing time (20min), lower curing temperature (90°C) and higher adhesion strength (7.6MPa). The resistivity of AG-80 sample has the lower value (2.13 × 10-4Ω•cm) than the 618 sample (4.44 × 10-4Ω•cm).