Characterization of low impedance 3d coplanar waveguide interconnects for compact MMICs

TALENTA - Conference on Engineering, Science and Technology 2017

工业技术;自然科学

Sinulingga, E.P.^1 ; Kyabaggu, P.B.K.^2 ; Sedayu, C.D.^1 ; Rezazadeh, A.A.^3

Electrical Engineering Department, Universitas Sumatera Utara, Indonesia^1

Bukoola General Enterprises, Kampala, Uganda^2

University of Manchester, Manchester, United Kingdom^3

关键词: Characteristic impedance;    Coplanar waveguide interconnects;    Design structure;    Distributed capacitance;    Microwave applications;    Microwave characteristics;    Multilayer technology;    Signal conductors;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/309/1/012070/pdf
DOI  :  10.1088/1757-899X/309/1/012070

来源: IOP

【 摘 要 】

Low characteristic impedance coplanar waveguide (CPW) interconnects are desirable for microwave applications such as power FET's and photodiodes. In conventional planar MMICs, typical characteristic impedances are in the range of 40-100Ω, such that in order to realize 20Ω interconnect, one has to fabricate a very narrow slot width with a wider signal conductor width. As the objective is to achieve low characteristic impedance interconnects (