Self-Repairing Mechanism of MUF/Epoxy Microcapsules for Epoxy Material

5th Annual International Conference on Material Science and Engineering

Ni, Zhuo^1 ; Lin, Yuhao^2 ; Zhou, Xiaobo^1

College of Chemistry and Chemical Engineering, Shenzhen University Shenzhen, China^1

Lin. College of Chemistry and Chemical Engineering, Shenzhen University Shenzhen, China^2

关键词: Fluorescent technique;    Infrared microscope;    Microcapsule content;    Physiochemical process;    Self healing mechanism;    Self repairing mechanism;    Self-healing process;    Three-point-bending experiments;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/275/1/012018/pdf
DOI  :  10.1088/1757-899X/275/1/012018

来源: IOP

【 摘 要 】

In this paper, a post curing reaction for the microcapsule/epoxy composite material and the conditions of thermal treatment for self-healing process were studied by differential scanning calorimetry (DSC). The condition of thermal treatment for post curing (60°C, 2 hours) was employed to fully cure the epoxy composite. Damage mechanism for the epoxy material was demonstrated via data simulation and three-point bending experiment for the stress distribution reveals that micro-cracks are more likely to be generated on the central region in stress concentration area of two constrained boundaries and the numbers of micro-cracks are reduced from the central area to the two ends of the material. Self-repairing performances of MUF microcapsule/epoxy composite materials were characterized using both destructive bending tests and non-destructive DMA measurements. Self-healing efficiencies of the composites embedded 2% and 5% microcapsule content measured by DMA are 101% and 104% respectively which are close to those results of 104% and 113% correspondingly measured by bending tests. Crack formation and development, core material releasing for MUF microcapsules and physiochemical process of the self-repairing were investigated by using OM, fluorescent technique and infrared microscope. These provide detailed evidences and important information on self-healing mechanism of the microcapsule/epoxy self-repairing material.