Analysis of Surface and Subsurface Damage Morphology in Rotary Ultrasonic Machining of BK7 Glass

2017 4th International Conference on Advanced Materials, Mechanics and Structural Engineering

材料科学;机械制造

Wang, Hong-Xiang^1 ; Wang, Chu^1 ; Liu, Jun-Liang^1 ; Gao, Shi^1 ; Zhai, Wen-Jie^1

School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, Heilongjiang, China^1

关键词: Abrasive grains;    Deformation areas;    Formation process;    Grinding surfaces;    High frequency vibration;    Material surface;    Rotary ultrasonic machining;    Sub-surface damage;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/269/1/012071/pdf
DOI  :  10.1088/1757-899X/269/1/012071

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

This paper investigates the formation process of surface/subsurface damage in the rotary ultrasonic machining of BK7 glass. The results show that during the milling using the end face of the tool, the cutting depth and the residual height between the abrasive grains constantly change with the high-frequency vibration, generating lots of cracks on both sides of the scratches. The high-frequency vibration accelerates the chips falling from the surface, so that the chips and thermal damage are reduced, causing the grinding surface quality better. A plastic deformation area is formed during the grinding, due to the non-uniform cutting force on the material surface, and the residual stress is produced in the deformation area, inducing the median/lateral cracks.