Application of COMSOL Multiphysics in Thermal Effect Analysis of Electromagnetic Active Vibration Absorber

2017 4th International Conference on Advanced Materials, Mechanics and Structural Engineering

材料科学;机械制造

Su, Hang^1 ; Weng, Xue-Tao^2

College of Power Engineering, Naval Univ. of Engineering, Wuhan

430033, China^1

National Key Laboratory on Ship Vibration and Noise, Naval Univ. of Engineering, Wuhan

430033, China^2

关键词: Comsol multiphysics;    Electromagnetic absorbers;    Electromagnetic vibrations;    Finite element analysis software;    Internal temperature distribution;    Magnetic circuit structures;    Simulation analysis;    Two dimensional distribution;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/269/1/012037/pdf
DOI  :  10.1088/1757-899X/269/1/012037

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

At present, there are some researches in the thermal analysis of electromagnetic absorbers. The heating principle of electromagnetic absorber magnetic circuit is analysed, and the finite element method is used to numerically solve the temperature field in the working process of electromagnetic vibration absorber. The magnetic circuit simulation model of electromagnetic vibration absorber is established in Comsol Multiphysics finite element analysis software. And the grid Division, simulation analysis of the vibration absorber magnetic circuit structure of the internal temperature distribution, you can get the vibration absorber magnetic circuit in the working process of the temperature field of two-dimensional distribution graphics and magnetic circuit structure of different parts of the temperature rise contrast chart. The conclusion provides some theoretical reference for the design and research of electromagnetic active vibration absorber.