Effect of DT4 Interlayer on Properties of Hot-roll Bonding TA2/Q235B Plate

2017 2nd International Conference on Advanced Materials Research and Manufacturing Technologies

材料科学;机械制造

Yu, Chao^1 ; Xiao, Hong^1 ; Li, Na^2 ; Qi, Zichen^1 ; Ren, Zhongkai^1

National Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao, Hebei, China^1

College of Mechanical Engineering, Yanshan University, Qinhuangdao, Hebei, China^2

关键词: Bonding interfaces;    Composite plates;    Compound layer;    Microstructure and properties;    Reduction ratios;    Tensile shears;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/229/1/012017/pdf
DOI  :  10.1088/1757-899X/229/1/012017

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

In this paper, a Q235B/TA2/DT4/Q235B plate was bonded by hot-rolling in a vacuum, and the effect of including a DT4 interlayer within the TA2/Q235B plate was studied. The microstructure and properties of the composite plate at different reduction ratios were investigated by scanning electron microscopy, as well as tensile-shear, bending and tensile tests. The results show that when the reduction ratio is below 18%, the shear strength of the interface is higher with the DT4 interlayer than without it. At 35% reduction, the shear strength is similar in both cases. At a reduction ratio of 68%, with the DT4 interlayer, fracture of the bonding interface occurs on the TA2 side, whereas without the DT4 interlayer, fracture occurs on both the TA2 side and the compound layer on the interface. Including the DT4 interlayer improves the bending and tensile properties of the TA2/Q235B plate appreciably.