A new application of SAM in the non-destructive inspection for SIM card

2nd International Conference on Design, Materials, and Manufacturing

材料科学;机械制造

Cai, Bin^1,2 ; He, Yandong^3 ; Zhao, Yang^1,2 ; Chen, Yanning^1,2 ; Zhang, Haifeng^1,2 ; Zhao, Dongyan^1,2

State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology, Beijing Smart-chip Microelectronics Technology Co., Ltd., Beijing

100192, China^1

Beijing Engineering Research Center of High-reliability IC with Power Industrial Grade, Beijing Smart-chip Microelectronics Technology Co., Ltd., Beijing

100192, China^2

School of Electronics Engineering and Computer Science, Peking University, Beijing

100871, China^3

关键词: Die thickness;    IC manufacturing;    Inspection methods;    New applications;    Non destructive inspection;    Scanning Acoustic Microscopy;    Scanning mode;    Thickness model;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/220/1/012022/pdf
DOI  :  10.1088/1757-899X/220/1/012022

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

Scanning Acoustic Microscopy (SAM) is a typical inspection method in the semiconductor IC manufacturing industry. Because the die thickness is a key parameter for SIM card, a new method to measure the internal die thickness of SIM card is proposed with SAM's reflective scanning mode. Using this method the internal die thickness of SIM card can be accurately measured without introducing any damages to SIM card. The thickness model and methodology based on the SAM signals have been established. The model was properly verified and calibrated by two real test cases.