Intermetallic Growth Retardation with the Addition of Graphene in the Sn-3.5Ag Lead-free Solder

2nd International Conference on Materials Engineering and Nanotechnology

材料科学;物理学

Mayappan, R.^1 ; Salleh, A.^2

Faculty of Applied Science, Universiti Teknologi MARA, Perlis Campus, Arau-Perlis

02600, Malaysia^1

Faculty of Applied Science, Universiti Teknologi MARA, Shah Alam, Selangor

40450, Malaysia^2

关键词: Graphene nanosheets;    IMC layer;    Intermetallic growth;    Isothermal aging;    Kinetics calculations;    Planar-shaped;    Sn-3.5Ag lead-free solders;    Sn-3.5Ag solders;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/205/1/012017/pdf
DOI  :  10.1088/1757-899X/205/1/012017

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

In this study, the effect of 0.07 wt.% graphene nanosheets (GNSs) on the thermal, microstructure and intermetallic compounds (IMC) growth kinetics were investigated. Experimental results showed that addition of GNSs to the Sn-3.5Ag solder alloy slightly increased the melting temperature. Scanning electron microscope (SEM) micrograph revealed that with the addition of GNSs has transformed the morphologies of the interfacial IMC from scalloped to more planar-shaped after isothermal aging for 500 hours. Growth kinetics calculations show that the k value was reduced from 9.08 × 10-14cm2/s to 5.73 × 10-14cm2/s with the addition of graphene. Thereby, it indicates that the addition of GNSs suppressed the growth of the IMC layers hence retarded the IMC's growth.