Experimental and Transient Thermal Analysis of Heat Sink Fin for CPU processor for better performance

Frontiers in Automobile and Mechanical Engineering

Ravikumar, S.^1 ; Subash Chandra, Parisaboina^1 ; Harish, Remella^1 ; Sivaji, Tallapaneni^1

Department of Mechanical Engineering, Sathyabama University, Tamilnadu, Chennai

600 119, India^1

关键词: ANSYS;    Commercial packages;    Cooling solutions;    Electronic component;    Geometric variables;    Rectangular plates;    Thermal Performance;    Transient thermal analysis;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/197/1/012085/pdf
DOI  :  10.1088/1757-899X/197/1/012085

来源: IOP

【 摘 要 】

The advancement of the digital computer and its utilization day by day is rapidly increasing. But the reliability of electronic components is critically affected by the temperature at which the junction operates. The designers are forced to shorten the overall system dimensions, in extracting the heat and controlling the temperature which focus the studies of electronic cooling. In this project Thermal analysis is carried out with a commercial package provided by ANSYS. The geometric variables and design of heat sink for improving the thermal performance is experimented. This project utilizes thermal analysis to identify a cooling solution for a desktop computer, which uses a 5 W CPU. The design is able to cool the chassis with heat sink joined to the CPU is adequate to cool the whole system. This work considers the circular cylindrical pin fins and rectangular plate heat sink fins design with aluminium base plate and the control of CPU heat sink processes.