The determination of the thickness of the layers deposited on the electronic circuit boards through tribological methods

13th International Conference on Tribology

Petrescu, A.M.^1 ; Tudor, A.^1 ; Chiiu, G.^1 ; Stoica, N.A.^1 ; Bayr, U Cihak^2

University Politehnica of Bucharest, Department of Machine Elements and Tribology, Splaiul Independentei 313, Bucharest, Romania^1

Austrian Excellence Center for Tribology, Departament of Material Analysis, Street Viktor Kaplan 2, Wiener Neustadt

2700, Austria^2

关键词: Copper layer;    Electronic circuit boards;    Electronic industries;    PCB assembly;    Testing time;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/174/1/012026/pdf
DOI  :  10.1088/1757-899X/174/1/012026

来源: IOP

【 摘 要 】

The purpose of the paper is to determinate the thickness of the copper layer deposit on the electronic circuit boards, the thickness of the soldering alloy SAC 307 (96.5%Sn/3.0%Ag/0.7%Cu) deposit on the copper-PCB assembly used in electronic industry and also to determinate the sliding length of the sphere on those materials. Slurry composed of water and SiC was used to reduce the testing time. For the experiment a CSEM Calowear equipment was used and the tested materials were the layer of FR4(flame retardant 4) with copper deposit and the soldering alloy SAC 307.