Strengthening in a copper composite containing graphene nanofillers

3rd International Conference on Advanced Materials Research and Applications

Song, Y.^1 ; Liu, W.W.^1 ; Chen, Y.^1

School of Mechanical and Electric Engineering, Collaborative Innovation Center of Suzhou Nano Science and Technology, Soochow University, Suzhou

215123, China^1

关键词: Copper composites;    Cu matrix composites;    Dislocation densities;    Micro-indentation tests;    Micromechanical property;    Microstructure observation;    Strengthening mechanisms;    Thermal expansion mismatch;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/170/1/012017/pdf
DOI  :  10.1088/1757-899X/170/1/012017

来源: IOP

【 摘 要 】

Multi-layer graphenes (MLGs) reinforced Cu matrix composites were fabricated using spark plasma sintering in this research. Microstructure observation indicated that MLGs homogeneously disperse in the matrix to result in grain refinement. Instrumented spherical micro-indentation tests were conducted to evaluate micro-mechanical properties of the composites, and the elastic modulus and indentation yield strength of the 1.5 wt.% MLG/Cu composite increase up to ∼ 36% and ∼ 41% than those of the unreinforced Cu, respectively. Grain refinement, the enhanced dislocation density (EDD) due to the thermal expansion mismatch between Cu matrix and MLGs and Orowan are thought to be the main strengthening mechanisms in this research.