Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy

4th International Conference on Advances in Solidification Processes

材料科学;物理学

Spinelli, J.E.^1 ; Macedo, R.A.^1 ; Silva, B.L.^1 ; Garcia, A.^2

Department of Materials Engineering, Federal University of Sao Carlos - UFSCar, Sao Carlos, Sao Paulo

13565, Brazil^1

Department of Materials Engineering, University of Campinas, UNICAMP, PO Box 6122, Campinas, SP

13083-970, Brazil^2

关键词: Directionally solidified;    Lead-free solder alloy;    Metallic connections;    Microstructural aspects;    Microstructural features;    Secondary dendrite arm spacing;    Thermal parameters;    Transient heat flow;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/117/1/012028/pdf
DOI  :  10.1088/1757-899X/117/1/012028

学科分类：材料科学（综合）

来源: IOP

【 摘 要 】

In the present study a hypoeutectic Bi-1.5wt%Ag alloy was directionally solidified under transient heat flow conditions and the microstructure was analysed. Bi-Ag alloys are considered as potential alternatives to replace Pb-based alloys as solder materials for metallic connections under high temperatures. However, a lack of understanding regarding the effects of solidification thermal parameters (growth rate - VL, the cooling rate - ) on microstructural aspects is reported in literature. Another challenge is to improve properties and reliability. The results of the present study include the determination of the tip growth rate and the cooling rate by cooling curves recorded by thermocouples positioned along the casting length, metallography, X-ray fluorescence (XRF) and Vickers hardness. The entire directionally solidified Bi-1.5Ag microstructure was arranged by faceted Bi-rich dendrites surrounded by a eutectic mixture (Bi+Ag). The primary and secondary dendrite arm spacing (λ1and λ2), the interphase spacing (λ) and the diameter of Ag-rich particles were also measured along the casting length; and experimental growth laws. Relating these microstructural features to the experimental thermal parameters are proposed.