An experimental investigation on the effect of particle size on the thermal properties and void content of Solid Glass Microsphere filled epoxy Composites

5th National Conference on Processing and Characterization of Materials

Mishra, Debasmita^1 ; Satapathy, Alok^2

Department of Mechanical Engineering, VSSUT, Burla, Odisha

768018, India^1

Department of Mechanical Engineering, NIT, Rourkela, Odisha

769008, India^2

关键词: Different sizes;    Effective thermal conductivity;    Epoxy composite;    Experimental investigations;    Glass microspheres;    Theoretical values;    Thermal characterization;    Thermal insulation capabilities;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/115/1/012011/pdf
DOI  :  10.1088/1757-899X/115/1/012011

来源: IOP

【 摘 要 】

This paper investigates about the thermal characterization of Solid glass micro-sphere (SGM) filled epoxy composites. SGMs of different sizes are embedded in epoxy resin to fabricate composites by hand-layup technique. The composites for various SGM content ranging from 0 to about 35 vol % are thus fabricated and the effective thermal conductivities (keff) of the composites are estimated. The theoretical values are then compared with keffvalues obtained from the experiment. This study shows that the incorporation of SGm results in an improvement in thermal insulation capability of the polymer. Further, the influence of size and content of SGMs in the extent of reduction of keffwas studied. Also, the effect of void content on improving insulation capability of the composites was analysed.