Assesment of (Mn,Co)33O4 powders for possible coating material for SOFC/SOEC interconnects

39th International Microelectronics and Packaging IMAPS Poland 2015 Conference

无线电电子学

Szymczewska, D.^1 ; Molin, S.^2 ; Venkatachalam, V.^2 ; Chen, M.^2 ; Jasinski, P.^1 ; Hendriksen, P.V.^2

Faculty of Electronics, Telecommunications and Informatics, Gdansk University of Technology, ul. Narutowicza 11/12, Gdansk

80-233, Poland^1

Department of Energy Conversion and Storage, Technical University of Denmark, Frederiksborgvej 399, Roskilde

4000, Denmark^2

关键词: Coating material;    Controlled thickness;    Deposition Parameters;    Deposition voltage;    Electrophoretic deposition methods;    Interconnect coatings;    Pressed pellets;    Spinel powders;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/104/1/012017/pdf
DOI  :  10.1088/1757-899X/104/1/012017

来源: IOP

【 摘 要 】

In this work (Mn,Co)3O4spinel powders with different Mn:Co ratio (1:1 and 1:2) and from different commercial suppliers are evaluated for possible powder for production of interconnect coatings. Sinterability of the powders is evaluated on pressed pellets sintered in oxidizing and in reducing/oxidizing atmospheres. For selected powder, coatings are then prepared by the electrophoretic deposition method on Crofer 22 APU stainless steel coupons. Effects of dispersant/iodine content and deposition voltage and times are evaluated. Thickness as a function of deposition parameters is described. Results show that with appropriate powder it is possible to produce adherent protective coating with a well-controlled thickness.