Integration of electronic system with electro-thermally cooled IR detector: thermal analysis

39th International Microelectronics and Packaging IMAPS Poland 2015 Conference

无线电电子学

Raj, E.^1 ; Lisik, Z.^1 ; Ruta, L.^1 ; Guzowski, B.^1 ; Kalinowski, P.^2 ; Orman, Z.^2

Lodz University of Technology, Department of Semiconductor and Optoelectronic Devices, Wolczanska 211/215, Lodz

90-924, Poland^1

VIGO System S.A., Poznanska 129/133, Ozarow Mazowiecki

05-850, Poland^2

关键词: Infrared photodetector;    Laminate substrates;    Operating condition;    Preamplifier circuit;    Temperature differences;    Thermo-electric modules;    Thermoelectric cooler;    Wideband electronic systems;   

Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/104/1/012009/pdf
DOI  :  10.1088/1757-899X/104/1/012009

来源: IOP

【 摘 要 】

The paper presents thermal investigations of an idea of encapsulation in common, miniature package both preamplifier circuit and infrared photodetector cooled with the aid of four-stage thermoelectric module. Conducted numerical simulations show that the presence of electronics at printed circuit board with either ceramic or laminate substrate negligibly affects operation of thermoelectric cooler and hence, the operating conditions of the detector. Higher thermal loads are reported when placing wideband electronic system on the additional thermoelectric module. Even though, such solution reduces temperature difference between infrared sensor and the other part of electronics, additional cooler increases the amount of heat that must be dissipated from the package to the ambient.