Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

7th Young Researcher Meeting

Barbagallo, C.^1 ; Malgioglio, G.L.^2 ; Petrone, G.^1 ; Cammarata, G.^1

University of Catania, Department of Industrial Engineering, Viale A. Doria 6, Catania

95125, Italy^1

STMicroelectronics, IPD RandD, Stradale Primosole 50, Catania

95121, Italy^2

关键词: Effective plastic strain;    Electronic modules;    Lead-free solder joint;    Model implementation;    Number of cycles to failure;    Numerical procedures;    Steady and transient;    Stress-strain distributions;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/841/1/012014/pdf
DOI  :  10.1088/1742-6596/841/1/012014

来源: IOP

【 摘 要 】

For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers.