Numerical Simulation of Thin Film Breakup on Nonwettable Surfaces

34th UIT Heat Transfer Conference 2016

Suzzi, N.^1 ; Croce, G.^1

DPIA - Dipartimento Politecnico di Ingegneria e Architettura, Universitá di Udine, Via delle Scienze, Udine (UD)

33100, Italy^1

关键词: Complex configuration;    Curved substrates;    Disjoining pressures;    Dynamic contact angle;    Engineering applications;    Numerical results;    Numerical solvers;    Substrate surface;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/796/1/012038/pdf
DOI  :  10.1088/1742-6596/796/1/012038

来源: IOP

【 摘 要 】

When a continuous film flows on a nonwettable substrate surface, it may break up, with the consequent formation of a dry-patch. The actual shape of the resulting water layer is of great interest in several engineering applications, from in-flight icing simulation to finned dehumidifier behavior modeling. Here, a 2D numerical solver for the prediction of film flow behavior is presented. The effect of the contact line is introduced via the disjoining pressure terms, and both gravity and shear are included in the formulation. The code is validated with literature experimental data for the case of a stationary dry-patch on an inclined plane. Detailed numerical results are compared with literature simplified model prediction. Numerical simulation are then performed in order to predict the threshold value of the film thickness allowing for film breakup and to analyze the dependence of the dynamic contact angle on film velocity and position along the contact line. Those informations will be useful in order to efficiently predict more complex configuration involving multiple breakups on arbitrarily curved substrate surfaces (as those involved in in-flight icing phenomena on aircraft).