Approach to solution of coupled heat transfer problem on the surface of hypersonic vehicle of arbitrary shape

31st International Conference on Equations of State for Matter

Bocharov, A.N.^1 ; Bityurin, V.A.^1 ; Golovin, N.N.^2 ; Evstigneev, N.M.^1 ; Petrovskiy, V.P.^1 ; Ryabkov, O.I.^1 ; Teplyakov, I.O.^1 ; Shustov, A.A.^2 ; Solomonov, Yu.S.^2 ; Fortov, V.E.^1

Joint Institute for High Temperatures, Russian Academy of Sciences, Izhorskaya 13 Bldg 2, Moscow

125412, Russia^1

Open Joint Stock Company Corporation Moscow Institute of Heat Technology, Beryozovaya Avenue 10, Moscow

127273, Russia^2

关键词: Computational grids;    Coupled heat transfer;    Free stream mach numbers;    Geometrical shapes;    Heat and mass transfer;    High performance computing (HPC);    Iterative process;    Time-consuming parts;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/774/1/012157/pdf
DOI  :  10.1088/1742-6596/774/1/012157

来源: IOP

【 摘 要 】

In this paper, an approach to solve conjugate heat- and mass-transfer problems is considered to be applied to hypersonic vehicle surface of arbitrary shape. The approach under developing should satisfy the following demands. (i) The surface of the body of interest may have arbitrary geometrical shape. (ii) The shape of the body can change during calculation. (iii) The flight characteristics may vary in a wide range, specifically flight altitude, free-stream Mach number, angle-of-attack, etc. (iv) The approach should be realized with using the high-performance-computing (HPC) technologies. The approach is based on coupled solution of 3D unsteady hypersonic flow equations and 3D unsteady heat conductance problem for the thick wall. Iterative process is applied to account for ablation of wall material and, consequently, mass injection from the surface and changes in the surface shape. While iterations, unstructured computational grids both in the flow region and within the wall interior are adapted to the current geometry and flow conditions. The flow computations are done on HPC platform and are most time-consuming part of the whole problem, while heat conductance problem can be solved on many kinds of computers.