Temperature-dependence of Threshold Current Density-Length Product in Metallization Lines: A Revisit

4th International Conference on Science & Engineering in Mathematics, Chemistry and Physics 2016

数学;化学;物理学

Duryat, Rahmat Saptono^1 ; Kim, Choong-Un^2

Universitas Indonesia, Depok

16424, Indonesia^1

University of Texas at Arlington, TX

76019, United States^2

关键词: Blech effect;    Interconnect materials;    Temperature dependence;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/710/1/012044/pdf
DOI  :  10.1088/1742-6596/710/1/012044

来源: IOP

【 摘 要 】

One of the important phenomena in Electromigration (EM) is Blech Effect. The existence of Threshold Current Density-Length Product or EM Threshold has such fundamental and technological consequences in the design, manufacture, and testing of electronics. Temperature-dependence of Blech Product had been thermodynamically established and the real behavior of such interconnect materials have been extensively studied. The present paper reviewed the temperature-dependence of EM threshold in metallization lines of different materials and structure as found in relevant published articles. It is expected that the reader can see a big picture from the compiled data, which might be overlooked when it was examined in pieces.