A high-force, out-of-plane actuator with a MEMS-enabled microscissor motion amplifier

15th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications

物理学;能源学

Xie, Xin^1 ; Livermore, Carol^2

Department of Electrical and Computer Engineering, Northeastern University, Boston

MA

02115, United States^1

Department of Mechanical and Industrial Engineering, Northeastern University, Boston

MA

02115, United States^2

关键词: Force application;    Layer thickness;    Motion amplifier;    Out-of-plane actuator;    Out-of-plane displacement;    Silicone adhesives;    SU-8 microstructures;    Tactile display;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/660/1/012026/pdf
DOI  :  10.1088/1742-6596/660/1/012026

来源: IOP

【 摘 要 】

The design, fabrication, and demonstration of a set of 2 mm2, high-force actuators that combine piezoelectric in-plane actuators with MEMS-enabled scissor mechanisms (motion amplifiers) to simultaneously produce high out-of-plane forces and large out-of-plane displacements are presented. The microscissor motion amplifier employs two layers of lithographically-patterned SU-8 microstructure laminated with a thin film of structural polyimide and adhesive to form hinges. Performance is optimized by varying layer thickness and adhesive types. Measured displacements of >3 μm and measured forces of >5 mN are observed, corresponding to a displacement per unit area of 1.6 μm/mm2and a force per unit area of 2.6 mN/mm2. Cyanoacrylate adhesive provides superior performance to silicone adhesive, with larger force output. Thicker polyimide hinges provide smaller displacement but greater force than thinner polyimide hinges. These powerful, compact actuators have significant potential for high-force applications like tactile displays and micropumps.