Cu/Diamond composite heat-conducting shims

2nd International School and Conference Saint-Petersburg OPEN on Optoelectronics, Photonics, Engineering and Nanostructures

Galashov, E.N.^1 ; Yusuf, A.A.^1 ; Mandrik, E.M.^1

Department of Applied Physics, Scientific Research Department Novosibirsk State University, 2 Pirogov's Street, Novosibirsk

630090, Russia^1

关键词: Cu/diamond composites;    Diamond composite materials;    High thermal conductivity;    Thermal sintering;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/643/1/012089/pdf
DOI  :  10.1088/1742-6596/643/1/012089

来源: IOP

【 摘 要 】

Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 μm in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 W•m-1•K-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 • 10-6/°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.