TiO2 thin and thick films grown on Si/glass by sputtering of titanium targets in an RF inductively coupled plasma

15th Latin American Workshop on Plasma Physics; 21st IAEA TM on Research Using Small Fusion Devices

Valencia-Alvarado, R.^1 ; De La Piedad-Beneitez, A.^2 ; López-Callejas, R.^1,2 ; Mercado-Cabrera, A.^1 ; Peña-Eguiluz, R.^1 ; Muñoz-Castro, A.E.^1 ; Rodríguez-Méndez, B.G.^1 ; De La Rosa-Vázquez, J.M.^3

Instituto Nacional de Investigaciones Nucleares, Plasma Physics Laboratory, AP 18-1027, México, D.F.

11801, Mexico^1

Instituto Tecnológico de Toluca, AP 890, Toluca, Mexico^2

Esime-Zacatenco-IPN, AP 07738, México, D.F., Mexico^3

关键词: Cylindrical vessels;    Deposition conditions;    Inductive plasma;    Plasma parameter;    Stylus profilometer;    Substrates temperature;    Thin and thick films;    Working gas pressure;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/591/1/012042/pdf
DOI  :  10.1088/1742-6596/591/1/012042

来源: IOP

【 摘 要 】

TiO2thin and thick films were deposited on silicon/glass substrates using RF inductive plasma in continuous wave. The films thickness, as well as phases control, is achieved with a gradual increase in temperature substrates varying supplied RF power or working gas pressure besides deposition time as well. The deposition conditions were: argon 80%/oxygen 20% carefully calibrated mixture of 2 to 7×10-2mbar as working gas pressure range. Deposition time 0.5 to 5 hours, 500 or 600 W RF power at 13.56 MHz frequency and 242-345 °C substrates temperature range. The titanium dioxide deposited on the substrates is grown by sputtering of a titanium target negatively polarized at 3-5 kV DC situated 14 mm in front of such substrates. The plasma reactor is a simple Pyrex-like glass cylindrical vessel of 50 cm long and 20 cm in diameter. Using the before describe plasma parameters we obtained films only anatase and both anatase/rutile phases with stoichiometric different. The films were characterized by X-ray photoelectron spectroscopy (XPS), stylus profilometer, X-ray diffraction (XRD), scanning electron microscopy (SEM) and Raman spectroscopy.