会议论文详细信息
14th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications
A high Reliability Module with Thermoelectric Device by Molding Technology for M2M Wireless Sensor Network
物理学;能源学
Nakagawa, K.^1 ; Tanaka, T.^1 ; Suzuki, T.^1
FUJITSU LABORATORIES LTD., 10-1 Morinosato-Wakamiya, Atsugi
243-0197, Japan^1
关键词: Electrical reliability;    Fabrication method;    Heater temperatures;    Highly accelerated temperature and humidity stress test;    Machine to machines;    Molding technologies;    Temperature and humidities;    Thermoelectric devices;   
Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/557/1/012014/pdf
DOI  :  10.1088/1742-6596/557/1/012014
来源: IOP
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【 摘 要 】

This paper presents the fabrication of a new energy harvesting module that used the thermoelectric device (TED) by using molding technology. The output voltage per heater temperature of the TED module at 20 °C ambient temperature is 8mV/K and similar to the result with the aluminium heat sink which is almost the same fin size as the TED module. The accelerated environmental tests are performed on damp heat test that is an aging test under high temperature and high humidity, cold test and highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the electrical reliability in harsh environments. Every result of tests indicates that the TED and circuit board can be properly protected from harsh temperature and humidity by using molding technology, because the output voltage of after tested modules is reduced by less than 5%.This study presents a novel fabrication method for a high reliability TED-installed module appropriate for Machine to Machine wireless sensor networks

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