Low Reynolds turbulence model CFD simulation for complex electronic system: an industrial point of view

Eurotherm Seminar 102: Thermal Management of Electronic Systems

物理学;无线电电子学

Giannuzzi, M.^1

Prompt Engineering Srl, Via Livorno 60, 10144 Torino, Italy^1

关键词: Complex electronic systems;    Conjugate heat transfer;    Electronic component;    Electronic systems;    Recirculation bubbles;    Recirculation vortices;    Surface temperature distribution;    Wall mounted cubes;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/525/1/012002/pdf
DOI  :  10.1088/1742-6596/525/1/012002

来源: IOP

【 摘 要 】

In electronic systems the presence of bluff bodies, sharp corners and bends are the cause of flow separation and large recirculation bubbles. Since the recirculation vortices develop they encapsulate the heat from an electronic component becoming one of the major contributors of malfunction. Going in depth in this, some numerical simulations of conjugate heat transfer for a heat wall-mounted cube have been performed using the commercial CFD code scSTREAM V11 by Software Cradle Co, Ltd. It is well known that the reliability of CFD analysis depends heavily on the turbulent model employed together with the wall functions implemented. The three low- Reynolds k- turbulent models developed by Abe-Nagano-Kondoh have been validated against experimental data consisting mainly of velocity profiles and surface temperature distributions provided in literature. The performed validation shows a satisfactory agreement between the measured and simulated data. The turbulent model chosen is then used for the CFD simulation of a complex electronic system.