3D SEM for surface topography quantification _ a case study on dental surfaces

14th International Conference on Metrology and Properties of Engineering Surfaces

Glon, F.^1,2 ; Flys, O.^1,3 ; Lööf, P.-J.^1 ; Rosén, B.-G.^1

Halmstad University, Box 823, SE-301 18 Halmstad, Sweden^1

ENISE, 58 rue Jean Parot, 42023, Saint-Etienne, France^2

SP Technical Research Institute of Sweden, Box 857, SE-501 15 Borås, Sweden^3

关键词: Engineering surfaces;    Optical interferometer;    Parameter sensitivities;    Photogrammetric software;    Reference measurements;    Scanning interferometers;    Surface characterization;    Topography measurement;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/483/1/012026/pdf
DOI  :  10.1088/1742-6596/483/1/012026

来源: IOP

【 摘 要 】

3D analysis of surface topography is becoming a more used tool for industry and research. New ISO standards are being launched to assist in quantifying engineering surfaces. The traditional optical measuring instrumentation used for 3D surface characterization has been optical interferometers and confocal based instrumentation. However, the resolution here is limited in the lateral dimension to the wavelength of visible light to about 500 nm. The great advantage using the SEM for topography measurements is the high flexibility to zoom from low magnifications and locating interesting areas to high magnification of down to nanometer large surface features within seconds. This paper presents surface characterization of dental implant micro topography. 3D topography data was created from SEM images using commercial photogrammetric software. A coherence scanning interferometer was used for reference measurements to compare with the 3D SEM measurements on relocated areas. As a result of this study, measurements emphasizes that the correlation between the accepted CSI measurements and the new technology represented by photogrammetry based on SEM images for many areal characterization parameters are around or less than 20%. The importance of selecting sampling and parameter sensitivity to varying sampling is high-lighted. Future work includes a broader study of limitations of the photogrammetry technique on certified micro-geometries and more application surfaces at different scales.