Technological peculiarities of deposition anti-reflective layers in low-e coatings

Low temperature Plasma in the Processes of Functional Coating Preparation

Yurjev, Y.^1 ; Sidelev, D.^2

Head of Laboratory, Department of Hydrogen Energy and Plasma Engineering, National Research Tomsk Polytechnic University, Tomsk, Russia^1

Department of Hydrogen Energy and Plasma Engineering, National Research Tomsk Polytechnic University, Tomsk, Russia^2

关键词: Anti-reflection layers;    Anti-reflective layers;    Antireflective films;    Electrical discharges;    Hysteresis effect;    Optimum deposition;    Planar magnetron;    Technological feature;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/479/1/012018/pdf
DOI  :  10.1088/1742-6596/479/1/012018

来源: IOP

【 摘 要 】

This article reports on the investigation of technological features magnetron sputtering for deposition anti-reflection layers in low-emission (low-e) coatings. The three-layer TiO2-Cu-TiO2films were deposited by dual and planar magnetron sputtering systems (MS) on glass substrate. Studies of the current-voltage characteristics (CVC) and the hysteresis effect show that deposition of anti-reflection layers is possible in the transition mode with higher rates. For planar magnetron, the stability of electrical discharge parameters is achieved at 60 % O2content in mixture. The calculations optical band gap Egshow that anti-reflective films have a rutile or anatase phases that depending on the content O2in gas mixture. The optimum deposition conditions of TiO2films were determined for all modifications of magnetrons. Anti-reflective layers, which are deposited by balanced dual MS, improve the transparency of low-e coatings (integral TVISincrease in 15%).