Micro-fabrication of Flexible Coils with Copper Filled Through Polymer Via Structures

13th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications

物理学;能源学

Zhu, Q.S.^1,2 ; Toda, A.^3 ; Zhang, Y.^1,2 ; Itoh, T.^1,2 ; Maeda, R.^1,2

NMEMS Technology Research Organization, Namiki 1-2-1, Tsukuba, Ibaraki, 305-8564, Japan^1

National Institute of Advanced Industrial Science and Technology (AIST), 1-3-1 Kasumigaseki, Chiyoda-ku, Tokyo 100-8921, Japan^2

Meltex Inc., Kyowa Bldg., 2-28-5 Higashi-Nihonbashi, Chuo-ku, Tokyo 103-0004, Japan^3

关键词: Copper electrodeposition;    Current sensing;    Deformation degrees;    Flexible coils;    Metal filling;    Micro-machined;    Target object;    Thin polymer films;   

Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/476/1/012032/pdf
DOI  :  10.1088/1742-6596/476/1/012032

来源: IOP

【 摘 要 】

In this work, we present one flexible 3D micro-coil. This 3D micro-coil is successfully prepared in a thin polymer film with a thickness of 120μm. The flexible coil is expected to be used in current sensing and energy harvesting MEMS those require a large deformation degree to wrap target object. A typical micro-machined 3D coil is composed of bottom, vertical and top windings. We firstly adopt through polymer vias (TPVs) and metal filling technology to fabricate the vertical windings. A high-speed copper electrodeposition technology of TPVs is developed to obtain void-free vertical windings.