会议论文详细信息
13th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications
Micro Thermal Diode with Glass Thermal Insulation Structure Embedded in Vapor Chamber
物理学;能源学
Hirayanagi, T.^1 ; Tsukamoto, T.^2 ; Esashi, M.^3 ; Tanaka, S.^1
Department of Bioengineering and Robotics, Tohoku University, Sendai, Japan^1
Micro System Integration Center, Tohoku University, Sendai, Japan^2
Advanced Institute for Material Research, Tohoku University, Sendai, Japan^3
关键词: External force;    Fluid circulation;    Insulation structures;    Performance indices;    Reverse mode;    Thermal diodes;    Vapor chamber;    Water circulation;   
Others  :  https://iopscience.iop.org/article/10.1088/1742-6596/476/1/012019/pdf
DOI  :  10.1088/1742-6596/476/1/012019
来源: IOP
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【 摘 要 】

This paper reports a novel micro thermal diode with an embedded micro glass thermal insulation structure. The diodicity is given by wettability-driven one-way fluid circulation mechanism without any external force. The water circulation only occurs in "forward" mode, resulting in low thermal resistance. The glass thermal insulation structure enhances thermal insulation in "reverse" mode. The thermal insulation in forward and reverse mode, Rfand Rr, were measured as 2.06±0.34 K/W and 3.04±0.38 K/W, respectively. Therefore, the performance index, Rr/Rf, was 1.47±0.14.

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