Effect of particle treatment and adhesive type on physical, mechanical, and durability properties of particleboard made from Sorghum Bagasse

Friendly City 4 'From Research to Implementation For Better Sustainability'

地球科学;经济学

Heri Iswanto, Apri^1 ; Supriyanto, S.^2 ; Fatriasari, Widya^3 ; Susilowati, Arida^1

Department of Forest Product, Faculty of Forestry, Universitas Sumatera Utara, Padang-Bulan-Medan

20155, Indonesia^1

SEAMEO-BIOTROP, Bogor, Indonesia^2

Research Center for Biomaterials LIPI, Bogor, Indonesia^3

关键词: Chemical content;    Durability property;    Press machines;    Pressing time;    Sorghum bagasse;    Sweet sorghum stalks;    Thickness swelling;    Urea formaldehyde;   

Others  :  https://iopscience.iop.org/article/10.1088/1755-1315/126/1/012016/pdf
DOI  :  10.1088/1755-1315/126/1/012016

来源: IOP

【 摘 要 】

Refers to chemical content of sweet sorghum stalk especially for Numbu varian, sorghum bagasse issuitable for materials of particleboard. The objective of the experiment was to evaluate of particle treatment on physichal, mechanical, and durability properties of particleboard made from sorghum bagasse. For particle treatment, Sorghum bagasse immersed in cold water and hot water for 24 and 1 hours respectively. Particleboards were produced in size 25 by 25 cm2with thickness and density target of 0.8 cm and 0.7 g/cm3. Amount of 10% Urea formaldehyde (UF) and 7% isocyanat (MDI) adhesive level used for manufacturing of board. Particle and adhesive were blended with rotary blending. Afterward, it was placed into mat former with size of 25 by 25 cm2. Mat was pressed by hot press machine. The pressing was conducted on 130C temperature for UF resin and 160C for MDI resin, pressure of 25 kg/cm2and pressing time for 10 minutes. The results showed that particle soaking in hot water produced of lower thickness swelling compared to untreated board. Similar trend also occuron particleboard whichwas bonded with MDI resin. MDI as exterior adhesive resulted good performance in dimensional stability of sorghum bagasse particleboard. For UF bonded particleboard, immersing in hot water resulted in the low MOR, MOE and IB parameter. It's contrary with MDI bonded particleboard.